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Tantalum nitride, 99.5% (metals basis), Thermo Scientific Chemicals
Descrizione
Tantalum nitride is used to create barrier or glue layers between copper, or other conductive metals, and dielectric insulator films such as thermal oxides. These films are deposited on top of silicon wafers during the manufacture of integrated circuits, to create thin film surface mount resistors and has other electronic applications.
This Thermo Scientific Chemicals brand product was originally part of the Alfa Aesar product portfolio. Some documentation and label information may refer to the legacy brand. The original Alfa Aesar product / item code or SKU reference has not changed as a part of the brand transition to Thermo Scientific Chemicals.

Specifica
Specifica
Materiale o nome chimico | Tantalum nitride |
Punto di fusione | 3360°C |
Forma fisica | Powder |
Quantità | 50 g |
Note percentuale saggio | (metals basis) |
Informazioni di solubilità | Insoluble in water. |
Peso formulazione | 194.95 |
Percent Purity | 99.5% |
Odore | Odorless |
RUO – Research Use Only
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